A promoting group including Intel, HP, Texas Instrument, NEC, NXP Semiconductors and Microsoft introduced plans on releasing specifications for a revamped version of the Universal Serial Bus. The new version will include fiber-optics alongside the copper wire, which will increase the transfer rate up to ten times faster then the present USB 2.0(480 megabits/s). The new technology will also offer backwards compatibility and lower power consumption. Please mind that only the specifications for the new USB3.0 will be release in 2008. Any products actually using the new technology won't emerge until 2009/2010.

Source: News.com